Angstrom Engineering

Magnetron sputtering is a physical vapour deposition (PVD) process that uses a magnetically confined plasma to eject atoms from a target material, depositing them as a thin film on a substrate. It's used for producing dense, high-quality coatings in semiconductor, optics and materials research applications.

HiPIMS (High Power Impulse Magnetron Sputtering) applies very high power in short pulses rather than continuously, producing a denser plasma and higher ionisation of the sputtered material. This gives finer-grained, higher-density thin films than conventional magnetron sputtering, typically at slower deposition rates.

Chemical vapour deposition (CVD) builds a thin film through a chemical reaction of gas-phase precursors at the substrate surface, while physical vapour deposition (PVD) - covering sputtering and evaporation - physically transfers material from a source to the substrate without a chemical reaction. Angstrom Engineering supplies systems for both routes, including CVD, magnetron sputtering and electron beam evaporation.

Rapid thermal annealing (RTA) rapidly heats a substrate - often a semiconductor wafer - to a target temperature for a short, controlled duration, then cools it, to activate dopants, repair implant damage, or modify thin film properties without the diffusion that longer furnace anneals would cause.

Yes. Angstrom Engineering's electron beam evaporation systems use a focused electron beam to vaporise source material in vacuum, depositing high-purity thin films of metals and dielectrics for research and production applications.

An anti-reflective coating system deposits thin film layers that reduce surface reflection and improve light transmission, used for laser diode bars, telecom optical filters and other precision optical components.